Controllers, Controls, and Software

BXpa Pre-aligner

The BXpa wafer pre-aligner is the industry leader for speed and accuracy. The BXpa can achieve wafer orientations within a +/-.04 degree of accuracy and under one second, utilizing CCD array technology. It is available for use with 200 or 300 mm (7.87 or 11.8 in) wafer sizes and comes with vacuum chuck as standard.

The BXpa features plug-and-play integration with the BX Controller and is furnished with a fully connectorized cable set. In just a few minutes the BXpa can be installed, configured and operational.

CCD Array Technology

  • Plug-and-Play with BX controller – no external power source needed
  • Direct Control via BX controller – resulting in higher performance than serially controlled aligners
  • Small, compact form factor for both 200 mm (6.87 in) and 300 mm (11.8 in)
  • Higher tool yield via better precision
  • Higher productivity via fast wafer orientation
  • Accelerated production start via quick tool set-up 

Specifications

  • Overall Dimensions (LxWxH)

    280 x 100 x 291 mm (11 x 3.94 x 11.46 in)

  •  

    330 x 100 x 291 mm (13 x 3.94 x 11.46 in)

  • Chuck Height

    243 mm (9.57 in)

  • Weight

    5 kg (11 lbs)

  • Notch Position Accuracy (Theta)

    +/- 0.04 degrees

  • Wafer Centering Position

    +/- 25 microns

  • Accuracy (X, Y)

    0.0254 mm (0.001 in)

  • Precision Mode Align Time

    <1.8 sec

  • Speed Mode Align Time

    <800 msec

See Also

Semiconductor Wafer Handling

Welding Automation

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