- Military Aircraft
- Military Ground Vehicles
- Missile Guidance
- Medical Products
- RF Microwave / Antennas
- Wind Turbine
- Cell Towers
- Satellites
Printed Circuit Boards
Custom Circuit Boards
Technical Capabilities
Moog has complete in-house process capabilities which allow us to customize our processes to your design. Our staff carefully builds each board to meet customer specifications. Process engineers work to resolve any problems throughout each process step to make sure the board is manufactured properly. As a part of our quality assurance, our inspection staff also reviews the boards at various stages to ensure that we are meeting or exceeding customer quality requirements. We operate three shifts to make sure that our customer’s product never stops moving through the facility.
Manufacturing turn times are available beginning as quick as one day. Technology levels typically range from 1 - 24 layers with lines and spaces of .004 inch. We process a wide array of materials for flex, rigid flex, and rigid printed circuit board product. Our management and staff have in-depth experience in building printed circuit boards for the telecommunications, military and commercial industries.
Manufacturing Capabilities
| Description | Standard | Review |
|---|---|---|
| Layer Count | 16 | 24 |
| Board Thickness | .004-.125 inch | Up to .450 inch |
| Copper Foil Thickness (Min) | .5 oz./ft² | .25 oz./ft² |
| Copper Foil Thickness (Max.) External/Internal Layer | 2 oz./ft² | 10 oz./ft² (Special Projects) |
| Through Hole Size (Min. Drilled) | .008 inch | .006 inch |
| Hole Size, Plated (Dia. Tolerance) | +/- .002 inch | +/- .001 inch |
| Trace/Space Width | .004 inch / .004 inch | .003 inch / .003 inch |
| SMT Pitch | .015 inch | Below .015 inch |
| Aspect Ratio | 10:1 | Above 10:1 |
| Materials | • Dupont® LF and AP series material for Flex and Rigid Flex • *FR4 - ED130 / P / UV - FR402 / 04 / 05 - FR406 / BC / N • High temperature materials - FR408 - *Polyimide (P95) • High speed application materials - Rogers® 4003, *4350, etc. - Ceramic (TMM series, etc.) - BT - Teflon® (Rogers DuroidTM, etc.) • RoHS compliant materials - *IS410 (180 Tg material) - *IS400 / 402 / 410BC / 610 • *Nelco® (N105, N205, N3105, N4105) |
Other materials as requested by the customer |
| Final Finish | • HASL (Hot-Air-Solder-Level) • Immersion Silver • ENIG • Selective Gold • Hard Gold (130 - 180 Knopp) • Specialty Hard Gold (200 - 250 Knopp) • Wirebondable Gold |
Other finishes as requested by the customer |
| Manufacturing minimum turn times by layer for prototypes | • 2 - 4 Layer - 1 - 2 days • 6 - 12 Layer - 2 - 3 days • 14 - 24 Layer - 3 - 5 days |
Special process and flex applications |
| Manufacturing turn times by volume | • Mid Volume - 3 - 4 weeks • Low Production - 1 week |
High Production |
| * Denotes UL certification for specified material | ||
Typical Applications
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